Hot-Pressed Tile Blade With Laser Cut

1. Adopts hot-pressed sintering technology, firmly bonds diamond segments to steel core, higher structural stability than ordinary brazed tile blades.
2. 1.1mm ultra-thin diamond layer, paired with laser cut slots, reduces chipping and delivers clean precise cuts on porcelain & ceramic tiles.
3. Laser segmented slots dissipate heat and damp vibration effectively, lowers blade deformation risk during long continuous cutting.
4. Transparent visual core design helps operators align cutting line quickly, ideal for angle grinder dry tile cutting.
5. Different arbor sizes and segment specifications are available upon request.

1. Size selection: TS115WE (115mm/4.5") fits standard 4.5-inch angle grinders for small tile jobs; TS125WE (125mm/5.0") fits 5-inch grinders for larger tiles and deeper cuts.
2. Application by tile type: the ultra-thin 1.1mm diamond layer produces a narrow 1.1mm kerf that saves expensive tile material and prevents chipping on ceramic and glazed porcelain; not intended for concrete, stone or masonry.
3. Equipment matching: the 22.23mm (7/8") arbor bore fits common angle grinders directly; designed for dry cutting without water cooling.
4. Cutting result: the transparent steel core lets operators track the cut line in real time, while laser slots dissipate heat and damp vibration for clean, straight cuts on porcelain and ceramic tile.

Multiple bore diameter and tooth count options available to match your cutting machine.